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Xiaomi 11 Tear Down e senotsoe: Ke lintlha life tse Lokelang ho Eloa hloko?

Matsatsing ana, lintlha tse mabapi leXiaomi11 li koaheloa butle-butle.Ba bang ba li-bloggers le bona ba ile ba arolelana disassembly eaXiaomi11. Lintlha tse ling tse ke keng tsa fosoa ke tsena.

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1. Ka bobeli Snapdragon 888 le memori ea flash li tiisitsoe ka sekhomaretsi, se ka ntlafatsang polokeho ea mohala oa thekeng ha o oela kapa o kena ka metsing.

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2. Khamera e kholo ea CMOS e kenaSamsungHMX, macro keSamsungS5K5E9, ka pele keSamsungS5K3T2, 'me angle e pharaletseng ke OV13B10, cheSonytharollo e sebelisoa.

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3. Sekoahelo se seholo sa khalase ea khamera se amohela ts'ebetso e ts'oanang ea CNC e kopantsoeng le iPhone, 'me lense ea macro e sebelisa ka ho toba khalase ea sekoahelo, e fanang ka litlhoko tse phahameng bakeng sa ts'ebetso ea optical le flatness ea sekoahelo sa khalase,' me bothata ba ho sebetsana le karabo ke hape e phahameng.

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4. Ho senya mocheso, lipoleiti tse chesang tsa VC kaofela li koahetsoe ka lebokose la li-motherboard, 'me tšebeliso ea foil ea koporo, graphite, grease ea silicone, li-aerogels le lisebelisoa tse ling ha li hlaba.

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5. E le ho fokotsa monyetla oa ho ama ka bohata skrineng se kobehileng, ho kenyelletsoa sensor e ncha ea gripXiaomi11, e kopanyang hardware le software.

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6. Mabapi le taolo ea mocheso oa fuselage, ts'ebetso ea letlalo le bonolo le khalase ea phetolelo e ts'oana, HDR HD 60Hz e ja khoho ka halofo ea hora, boholo ba pele bo ka bang likhato tse 41, boholo ba morao bo ka bang likhato tse 40.

VC

 

Mocheso oa Snapdragon 888 ka boeona o loketse haholo.Ka mor'a hore blogger e leke ho tlosa lisebelisoa tsohle tsa ho senya mocheso tse kang foil ea koporo le thebe ea tšepe, o fumane hore SOC ena e ka ama habonolo ho feta likhato tse 80.

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Nako ea poso: Dec-29-2020